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Application
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Apply online or email min.pei@intel.com
Posting Date Sep 2, 2007, 10:21 PM, Montreal, New York,
Washington D.C. - (UTC -5:00)
Apply Before Oct 30, 2007, 07:59 PM, Montreal, New York,
Washington D.C. - (UTC -5:00)
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Description
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In this position, you will be
supporting Q&R assessments of electronic packaging currently under
development. You will also be responsible for assessing end customer environments,
designing, testing, behaviors and requirements then translating data into
reliability tests, analyzing, and enveloping methods to insure Intel
products meet customer demands. Your responsibilities will include but not
be limited to:
- Responsible for the development of reliability risk assessments for
technologies
- Providing technical inputs on the design of test chips and package
assembly test vehicles
- Designing and executing experiments to identify reliability failure
mechanisms, communication of reliability results, risks and recommendations
and development of improved Q&R methods and business processes
- Developing, modifying, applying, and maintaining quality standards for
processing materials into partially finished or finished material or
product
- Devising and implementing methods and procedures for inspecting, testing,
and evaluating the precision and accuracy of products and production
equipment
- Designing or specifying inspection, testing mechanisms and equipment
- Conducting quality assurance tests and performing statistical analysis to
assess the cost of, and determining the responsibility for products or
materials that do not meet required standards and specifications
- Specializing in the areas of design, incoming material, production
control, product evaluation and reliability, inventory control, and/or
research and development as they apply to quality control
- Responding to customer and/or client requests or events as they occur
- Developing solutions to problems utilizing formal education and judgment
Qualifications
You should possess a Ph.D. or a Master of Science degree in Mechanical
Engineering. Additional qualifications include:
- Ability to analyze and distill data into information and use the
appropriate tools (graphs, flow charts, and others) to present findings
- Good project organization skills
- Mature presentation and writing skills
- Strong analytical and experimental background in dynamics (including
shock, random vibration, and high-cycle fatigue, demonstrated via graduate
level research and technical publications)
- Strong analytical and experimental background in structural mechanics,
multi-physics or similar (experimental and analytical experience with the
high-cycle fatigue, moisture and vapor pressure simulation and electromigration modeling demonstrated via graduate
level research and technical publications)
- Understanding of statistics, advanced material models, and general
mechanical testing techniques would be an added advantage
- Knowledge of commercial Finite Element Analysis (FEA) software (ABAQUS*),
electronic packaging and assembly technology would be an added advantage
Business Group
As the world's largest chip manufacturer, Intel strives to make every facet
of semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to final
test and optimization, and lastly packaging. Employees in the Technology
and Manufacturing group are part of a worldwide network of manufacturing
and assembly and/or test facilities.
Technology Development (TD) Quality and Reliability (Q&R) is a fast
paced, dynamic, multitask environment requiring decision making at the
strategic and tactical levels. The job requires a highly motivated self-starter
able to work with minimal supervision in a team environment.
Shift
Regular Days
Relocation Approved
No
Hiring Manager
Lucero,Alan E
Job Grade
08
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